Copper micro and nano particles mixture for 3D interconnection application

• المؤلف الرئيسي: Dai, Yuan-Yuan
• مؤلفون آخرون: Tan Chuan Seng
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2016
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/67807
• المؤسسة: Nanyang Technological University

Copper is a well-known material used for interconnections application. It offers economical advantage over silver and has high electrical conductivity. Studies on copper nano-paste (comprising of monodispersed nano-particles) application on surfaces have reported cracking and a low packing densit...