Copper micro and nano particles mixture for 3D interconnection application
Copper is a well-known material used for interconnections application. It offers economical advantage over silver and has high electrical conductivity. Studies on copper nano-paste (comprising of monodispersed nano-particles) application on surfaces have reported cracking and a low packing densit...
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| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2016
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| Online Access: | http://hdl.handle.net/10356/67807 |
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| Institution: | Nanyang Technological University |
| Language: | English |