Copper micro and nano particles mixture for 3D interconnection application
Copper is a well-known material used for interconnections application. It offers economical advantage over silver and has high electrical conductivity. Studies on copper nano-paste (comprising of monodispersed nano-particles) application on surfaces have reported cracking and a low packing densit...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2016
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/67807 |
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| 機構: | Nanyang Technological University |
| 語言: | English |