Optimizing of TiN barrier properties for CNT interconnects

This report aims to investigate the various parameters on optimizing of the Titanium Nitride (TiN) thin films to achieve low resistivity, fabrication of four point probe flip chip design and measurement of the flip chip interconnection resistance. Three controlled parameters are experimented in the...

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Bibliographic Details
Main Author: Ng, Anthony Tian Shi
Other Authors: Tay Beng Kang
Format: Final Year Project
Language:English
Published: 2012
Subjects:
Online Access:http://hdl.handle.net/10356/50111
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Institution: Nanyang Technological University
Language: English