Texture and stress study of barrier layers on various low-K materials in copper technology
The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu) interconnects and electrical performance of the structure had been investigated.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/4432 |
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| Institution: | Nanyang Technological University |