Texture and stress study of barrier layers on various low-K materials in copper technology
The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu) interconnects and electrical performance of the structure had been investigated.
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2008
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Online Access: | http://hdl.handle.net/10356/4432 |
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sg-ntu-dr.10356-44322023-07-04T15:09:31Z Texture and stress study of barrier layers on various low-K materials in copper technology Jia, Guojun Zhang, Dao Hua School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu) interconnects and electrical performance of the structure had been investigated. Master of Science (Microelectronics) 2008-09-17T09:51:22Z 2008-09-17T09:51:22Z 2004 2004 Thesis http://hdl.handle.net/10356/4432 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Jia, Guojun Texture and stress study of barrier layers on various low-K materials in copper technology |
description |
The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu) interconnects and electrical performance of the structure had been investigated. |
author2 |
Zhang, Dao Hua |
author_facet |
Zhang, Dao Hua Jia, Guojun |
format |
Theses and Dissertations |
author |
Jia, Guojun |
author_sort |
Jia, Guojun |
title |
Texture and stress study of barrier layers on various low-K materials in copper technology |
title_short |
Texture and stress study of barrier layers on various low-K materials in copper technology |
title_full |
Texture and stress study of barrier layers on various low-K materials in copper technology |
title_fullStr |
Texture and stress study of barrier layers on various low-K materials in copper technology |
title_full_unstemmed |
Texture and stress study of barrier layers on various low-K materials in copper technology |
title_sort |
texture and stress study of barrier layers on various low-k materials in copper technology |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/4432 |
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1772825946939719680 |