Development and characterization of deep reactive ion etching technology for through silicon interconnection

• المؤلف الرئيسي: Nagarajan, Ranganathan
• مؤلفون آخرون: Pey Kin Leong
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/41775

Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of planar integrated circuits. This work focuses on various challenges associated with deep reactive ion etching technology for realizing through silicon interconnection for 3D Microsystems application....