Development and characterization of deep reactive ion etching technology for through silicon interconnection

• Main Author: Nagarajan, Ranganathan
• Other Authors: Pey Kin Leong
• Format: Theses and Dissertations
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: https://hdl.handle.net/10356/41775
• Institution: Nanyang Technological University

Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of planar integrated circuits. This work focuses on various challenges associated with deep reactive ion etching technology for realizing through silicon interconnection for 3D Microsystems application....