Copper nanowires bonding for three dimensional interconnections

• Main Author: Chun, Shu Rong
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Materials::Metallic materials
• Online Access: https://hdl.handle.net/10356/69104
• Institution: Nanyang Technological University

Over the past few decades, the semiconductor industry has been advancing by increasing transistor density on a microchip through continuous device scaling based on the technology roadmap driven by Moore’s Law. However, new physical phenomena at scaled dimensions and fundamental limitations in materi...