Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element mod...
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| Format: | Research Report |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6947 |
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| Institution: | Nanyang Technological University |
| Summary: | The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element modeling and analytical investigation have been carried out to analyze the moisture absorption behavior of the encapsulant materials. The current report writing is based on the objectives proposed in the research proposal. |
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