Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits

• Main Author: Xiao, Zhongmin
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing::Polymers and plastics
• Online Access: http://hdl.handle.net/10356/6947
• Institution: Nanyang Technological University

The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element mod...