Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits

Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits

The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element mod...

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Bibliographic Details
Main Author: Xiao, Zhongmin
Other Authors: School of Mechanical and Production Engineering
Format: Research Report
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Polymers and plastics
Online Access:http://hdl.handle.net/10356/6947
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-6947
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spelling sg-ntu-dr.10356-69472023-03-04T18:08:10Z Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits Xiao, Zhongmin School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing::Polymers and plastics The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element modeling and analytical investigation have been carried out to analyze the moisture absorption behavior of the encapsulant materials. The current report writing is based on the objectives proposed in the research proposal. 2008-09-17T14:37:47Z 2008-09-17T14:37:47Z 2003 2003 Research Report http://hdl.handle.net/10356/6947 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing::Polymers and plastics
spellingShingle DRNTU::Engineering::Manufacturing::Polymers and plastics
Xiao, Zhongmin
Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
description The purpose of this project is to characterize moisture-temperature-dependent mechanical behavior of molding compounds, and chemo-hygro-thermo-rheologically complex material behaviors of thermosetting molding compounds with various filler contents during the curing processes. Both finite element modeling and analytical investigation have been carried out to analyze the moisture absorption behavior of the encapsulant materials. The current report writing is based on the objectives proposed in the research proposal.
author2 School of Mechanical and Production Engineering
author_facet School of Mechanical and Production Engineering
Xiao, Zhongmin
format Research Report
author Xiao, Zhongmin
author_sort Xiao, Zhongmin
title Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
title_short Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
title_full Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
title_fullStr Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
title_full_unstemmed Research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
title_sort research and development of advanced engineering mechanics technology for design and manufacturing of plastic encapsulated integrated circuits
publishDate 2008
url http://hdl.handle.net/10356/6947
_version_ 1759856090569244672

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