Dynamic characteristics of ultrasonic wire bonders

• Main Authors: Guo, Ningqun., Ling, Shih Fu.
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing::Product engineering
• Online Access: http://hdl.handle.net/10356/6992
• Institution: Nanyang Technological University

This report describes the work undertaken under an applied research project that aims to study the dynamic characteristics of the wire bonder, and consists of two major parts, dynamic of ultrasonic transducer and modelling of bonding process