Dynamic characteristics of ultrasonic wire bonders
This report describes the work undertaken under an applied research project that aims to study the dynamic characteristics of the wire bonder, and consists of two major parts, dynamic of ultrasonic transducer and modelling of bonding process
Saved in:
Main Authors: | Guo, Ningqun., Ling, Shih Fu. |
---|---|
Other Authors: | School of Mechanical and Production Engineering |
Format: | Research Report |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/6992 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Development of indexing clamper mechanism for wire bonder
by: Zhang, Yue.
Published: (2008) -
Design of heat tunnel for a wire bonder
by: Goh, Swee Leong.
Published: (2009) -
Study of mechanism of ultrasonic wire bonding process
by: Zhang, Dong
Published: (2008) -
Dynamic characteristics of the wire bonding process in electronic packaging
by: Hu, Changmin.
Published: (2008) -
Design and production of dies for micro wire drawing
by: Tan, Guo Dong.
Published: (2010)