Deep convolutional neural networks for manufactured IC image analysis

Image analysis for manufactured Integrated Circuits (IC) plays an important role in IC function verification, hardware security assurance, intellectual property protection, and etc. Circuit extraction is one of the most common and reliable approaches to manufactured IC image analysis. However, the a...

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Main Author: Tan, Weiwei
Other Authors: Gwee Bah Hwee
Format: Final Year Project
Language:English
Published: 2019
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Online Access:http://hdl.handle.net/10356/78126
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-781262023-07-07T15:56:43Z Deep convolutional neural networks for manufactured IC image analysis Tan, Weiwei Gwee Bah Hwee School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Image analysis for manufactured Integrated Circuits (IC) plays an important role in IC function verification, hardware security assurance, intellectual property protection, and etc. Circuit extraction is one of the most common and reliable approaches to manufactured IC image analysis. However, the annotation of delayered IC images, which is a crucial step for circuit extraction, is getting infeasible with conventional manual methods due to the increasing complexity of modern VLSI designs. Thus, recent research efforts have been devoted to automating the IC image annotation process using image processing or machine learning techniques. In this final year project, we first developed a deep convolutional neural network based segmentation model (wptnet) for pixel-wise annotation of circuit components in the metal layer of our delayered IC images. Our proposed wptnet achieved mean intersection over union of 88.98% and mean pixel accuracy of 94.35% when applied to 880 testing images from IC metal layer (image dimension: 224 × 224 pixels). However, IC chips normally have more than one layer and images of different IC layers exhibit different image features. Therefore, the segmentation performance of our proposed model will be degraded if a model trained on one layer is applied to a different layer. For example, our wptnet trained on our source set of IC images mentioned above can only achieve mean intersection over union of 81.54% and mean pixel accuracy of 89.54% on our target set of IC images which are slightly different from our source set. Preparing another set of training data for model retraining on a different set of IC images to preserve the performance on a different layer is time-consuming and resource-demanding. To improve the efficiency, we further present a wptnetDA network which incorporates domain adaptation techniques to perform the segmentation of delayered images from different layers. Specifically, we adopted domain confusion with Maximum Mean Discrepancy (MMD). Our wptnetDA model can then achieve mean intersection over union of 88.51% and mean pixel accuracy of 95.74% on the target set of images without degrading the performance on the source set. Bachelor of Engineering (Electrical and Electronic Engineering) 2019-06-12T06:18:09Z 2019-06-12T06:18:09Z 2019 Final Year Project (FYP) http://hdl.handle.net/10356/78126 en Nanyang Technological University 67 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Tan, Weiwei
Deep convolutional neural networks for manufactured IC image analysis
description Image analysis for manufactured Integrated Circuits (IC) plays an important role in IC function verification, hardware security assurance, intellectual property protection, and etc. Circuit extraction is one of the most common and reliable approaches to manufactured IC image analysis. However, the annotation of delayered IC images, which is a crucial step for circuit extraction, is getting infeasible with conventional manual methods due to the increasing complexity of modern VLSI designs. Thus, recent research efforts have been devoted to automating the IC image annotation process using image processing or machine learning techniques. In this final year project, we first developed a deep convolutional neural network based segmentation model (wptnet) for pixel-wise annotation of circuit components in the metal layer of our delayered IC images. Our proposed wptnet achieved mean intersection over union of 88.98% and mean pixel accuracy of 94.35% when applied to 880 testing images from IC metal layer (image dimension: 224 × 224 pixels). However, IC chips normally have more than one layer and images of different IC layers exhibit different image features. Therefore, the segmentation performance of our proposed model will be degraded if a model trained on one layer is applied to a different layer. For example, our wptnet trained on our source set of IC images mentioned above can only achieve mean intersection over union of 81.54% and mean pixel accuracy of 89.54% on our target set of IC images which are slightly different from our source set. Preparing another set of training data for model retraining on a different set of IC images to preserve the performance on a different layer is time-consuming and resource-demanding. To improve the efficiency, we further present a wptnetDA network which incorporates domain adaptation techniques to perform the segmentation of delayered images from different layers. Specifically, we adopted domain confusion with Maximum Mean Discrepancy (MMD). Our wptnetDA model can then achieve mean intersection over union of 88.51% and mean pixel accuracy of 95.74% on the target set of images without degrading the performance on the source set.
author2 Gwee Bah Hwee
author_facet Gwee Bah Hwee
Tan, Weiwei
format Final Year Project
author Tan, Weiwei
author_sort Tan, Weiwei
title Deep convolutional neural networks for manufactured IC image analysis
title_short Deep convolutional neural networks for manufactured IC image analysis
title_full Deep convolutional neural networks for manufactured IC image analysis
title_fullStr Deep convolutional neural networks for manufactured IC image analysis
title_full_unstemmed Deep convolutional neural networks for manufactured IC image analysis
title_sort deep convolutional neural networks for manufactured ic image analysis
publishDate 2019
url http://hdl.handle.net/10356/78126
_version_ 1772828269619445760