Industrial attachment report with Micron Semiconductor Asia Pte Ltd
Two projects were performed: (1) involves verification of PBGA solder ball shear strength trend in terms of 2 pads designs, Solder Mask Defined and Non-Solder Mask Defined; (2) focus on module level reliability check out.
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2008
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| 在線閱讀: | http://hdl.handle.net/10356/8040 |
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