Report on industrial attachment with Micron Semiconductor Asia Pte Ltd

This report investigated substrate performance of different design and material for microelectronics packaging.

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Bibliographic Details
Main Author:	Ng, Yew Hong.
Other Authors:	School of Mechanical and Production Engineering
Format:	Industrial Attachment (IA)
Published:	2008
Subjects:	DRNTU::Engineering::Materials
Online Access:	http://hdl.handle.net/10356/8050
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Institution:	Nanyang Technological University

Description
Summary:	This report investigated substrate performance of different design and material for microelectronics packaging.

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