Report on industrial attachment with Micron Semiconductor Asia Pte Ltd

This report investigated substrate performance of different design and material for microelectronics packaging.

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Bibliographic Details
Main Author: Ng, Yew Hong.
Other Authors: School of Mechanical and Production Engineering
Format: Industrial Attachment (IA)
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/8050
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-8050
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spelling sg-ntu-dr.10356-80502020-06-01T10:44:39Z Report on industrial attachment with Micron Semiconductor Asia Pte Ltd Ng, Yew Hong. School of Mechanical and Production Engineering DRNTU::Engineering::Materials This report investigated substrate performance of different design and material for microelectronics packaging. 2008-09-19T01:55:38Z 2008-09-19T01:55:38Z 2000 2000 Industrial Attachment (IA) http://hdl.handle.net/10356/8050 Nanyang Technological University 126 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Ng, Yew Hong.
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
description This report investigated substrate performance of different design and material for microelectronics packaging.
author2 School of Mechanical and Production Engineering
author_facet School of Mechanical and Production Engineering
Ng, Yew Hong.
format Industrial Attachment (IA)
author Ng, Yew Hong.
author_sort Ng, Yew Hong.
title Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_short Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_full Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_fullStr Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_full_unstemmed Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
title_sort report on industrial attachment with micron semiconductor asia pte ltd
publishDate 2008
url http://hdl.handle.net/10356/8050
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