Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
This report investigated substrate performance of different design and material for microelectronics packaging.
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2008
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Online Access: | http://hdl.handle.net/10356/8050 |
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sg-ntu-dr.10356-80502020-06-01T10:44:39Z Report on industrial attachment with Micron Semiconductor Asia Pte Ltd Ng, Yew Hong. School of Mechanical and Production Engineering DRNTU::Engineering::Materials This report investigated substrate performance of different design and material for microelectronics packaging. 2008-09-19T01:55:38Z 2008-09-19T01:55:38Z 2000 2000 Industrial Attachment (IA) http://hdl.handle.net/10356/8050 Nanyang Technological University 126 p. application/pdf |
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Nanyang Technological University |
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Singapore |
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DRNTU::Engineering::Materials |
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DRNTU::Engineering::Materials Ng, Yew Hong. Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
description |
This report investigated substrate performance of different design and material for microelectronics packaging. |
author2 |
School of Mechanical and Production Engineering |
author_facet |
School of Mechanical and Production Engineering Ng, Yew Hong. |
format |
Industrial Attachment (IA) |
author |
Ng, Yew Hong. |
author_sort |
Ng, Yew Hong. |
title |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_short |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_full |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_fullStr |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_full_unstemmed |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_sort |
report on industrial attachment with micron semiconductor asia pte ltd |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/8050 |
_version_ |
1681057440656785408 |