Effect of chain length on low temperature gold-gold bonding by self assembled monolayers

The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achie...

Full description

Saved in:

Bibliographic Details
Main Authors:	Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
Other Authors:	School of Materials Science & Engineering
Format:	Article
Language:	English
Published:	2012
Subjects:	DRNTU::Engineering::Materials
Online Access:	https://hdl.handle.net/10356/85265 http://hdl.handle.net/10220/7703
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-85265
record_format	dspace
spelling	sg-ntu-dr.10356-852652023-07-14T15:45:31Z Effect of chain length on low temperature gold-gold bonding by self assembled monolayers Ang, X. F. Chen, Z. Wong, Chee C. Wei, J. School of Materials Science & Engineering DRNTU::Engineering::Materials The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achieved using octadecanethiol (n=18). These contrasting behaviors can be interpreted as a consequence of two dominant roles of alkanethiols that govern the bonding phenomenon, namely, the passivation of gold surfaces and the ease of mechanical and/or thermal displacement. Published version 2012-04-10T07:24:09Z 2019-12-06T16:00:39Z 2012-04-10T07:24:09Z 2019-12-06T16:00:39Z 2008 2008 Journal Article Ang, X. F., Chen, Z., Wong, C. C., & Wei, J. (2008). Effect of Chain Length on Low Temperature Gold-Gold Bonding by Self Assembled Monolayers. Applied Physics Letters, 92(13). https://hdl.handle.net/10356/85265 http://hdl.handle.net/10220/7703 10.1063/1.2906905 en Applied physics letters © 2008 American Institute of Physics. This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics. The paper can be found at the following DOI: http://dx.doi.org/ 10.1063/1.2906905. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. 3 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Materials
spellingShingle	DRNTU::Engineering::Materials Ang, X. F. Chen, Z. Wong, Chee C. Wei, J. Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
description	The tensile strength of thermocompression gold joints formed with prior surface coatings of alkanethiol self-assembled monolayers (SAMs) depends on the chain length (n) of the SAM. Enhancement of bond strength is most significant at n=6 while no improvement can be achieved using octadecanethiol (n=18). These contrasting behaviors can be interpreted as a consequence of two dominant roles of alkanethiols that govern the bonding phenomenon, namely, the passivation of gold surfaces and the ease of mechanical and/or thermal displacement.
author2	School of Materials Science & Engineering
author_facet	School of Materials Science & Engineering Ang, X. F. Chen, Z. Wong, Chee C. Wei, J.
format	Article
author	Ang, X. F. Chen, Z. Wong, Chee C. Wei, J.
author_sort	Ang, X. F.
title	Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_short	Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_full	Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_fullStr	Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_full_unstemmed	Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
title_sort	effect of chain length on low temperature gold-gold bonding by self assembled monolayers
publishDate	2012
url	https://hdl.handle.net/10356/85265 http://hdl.handle.net/10220/7703
_version_	1772828721803165696

Effect of chain length on low temperature gold-gold bonding by self assembled monolayers

Similar Items