Slurry flow visualisation of chemical mechanical polishing based on a computational fluid dynamics model

• Main Authors: Tian, Y. B., Lai, S. T., Zhong, Z. W.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2013
• Online Access: https://hdl.handle.net/10356/85373; http://hdl.handle.net/10220/10684
• Institution: Nanyang Technological University

In this work, we developed a computational fluid dynamics (CFD) model to simulate the slurry flow between the wafers and pad during the chemical mechanical polishing (CMP) process under a multiple-wafer configuration. A serial of simulations were carried out to visualise slurry flow and explore the...