Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate

• المؤلفون الرئيسيون: Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong
• مؤلفون آخرون: Interdisciplinary Graduate School (IGS)
• التنسيق: مقال
• اللغة: English
• منشور في: 2017
• الموضوعات: Surface Roughness; Copper-alumina Bonding
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/86256; http://hdl.handle.net/10220/43998
• المؤسسة: Nanyang Technological University

The evaluation of bonding mechanisms between magnetron sputtered copper (Cu) thin films and a ceramic substrate was carried out using polycrystalline and monocrystalline alumina (Al2O3) substrates with different surface roughness. Three different bonding mechanisms, viz., surface adsorption, mechani...