Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate

The evaluation of bonding mechanisms between magnetron sputtered copper (Cu) thin films and a ceramic substrate was carried out using polycrystalline and monocrystalline alumina (Al2O3) substrates with different surface roughness. Three different bonding mechanisms, viz., surface adsorption, mechani...

Full description

Saved in:
Bibliographic Details
Main Authors: Lim, Ju Dy, Lee, Pui Mun, Chen, Zhong
Other Authors: Interdisciplinary Graduate School (IGS)
Format: Article
Language:English
Published: 2017
Subjects:
Online Access:https://hdl.handle.net/10356/86256
http://hdl.handle.net/10220/43998
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English