Novel three-dimensional carbon nanotube networks as high performance thermal interface materials

• Main Authors: Kong, Qinyu, Bodelot, Laurence, Lebental, Bérengère, Lim, Yu Dian, Shiau, Li Lynn, Gusarov, Boris, Tan, Chong Wei, Liang, Kun, Lu, Congxiang, Tan, Chuan Seng, Tay, Beng Kang, Coquet, Philippe
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2018
• Subjects: DRNTU::Engineering::Electrical and electronic engineering; 3D CNT Network; In-plane Thermal Conductivity
• Online Access: https://hdl.handle.net/10356/87518; http://hdl.handle.net/10220/46556
• Institution: Nanyang Technological University

Vertically aligned carbon nanotube (VACNT) arrays are considered as promising thermal interface materials (TIMs) due to their superior out-of-plane thermal conductivities. However the air gaps between adjacent CNTs within the CNT array hinder the in-plane heat transfer, thus significantly degrading...