Modification of Ta/polymeric low-k interface by electron beam treatment

• Main Authors: Prasad, K., Damayanti, M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Chen, Zhe, Zhang, Sam, Jiang, Ning
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/90682; http://hdl.handle.net/10220/7701
• Institution: Nanyang Technological University

Polymeric dielectric, porous polyarylene ether (PAE), was introduced in the Cu damascene structures because of its low dielectric constant to reduce resistance-capacitance (RC) delay. One of the requirements of a low-k material includes its good adhesion to the other in...