Mathematical model of low-temperature wafer bonding under medium vacuum and its application

Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO2 and the diffusion theory in porous media. I...

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Main Authors: Yu, Weibo, Wei, Jun, Tan, Cher Ming, Huang, Guang Yu
其他作者: School of Electrical and Electronic Engineering
格式: Article
語言:English
出版: 2009
主題:
在線閱讀:https://hdl.handle.net/10356/90757
http://hdl.handle.net/10220/5336
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機構: Nanyang Technological University
語言: English