Mathematical model of low-temperature wafer bonding under medium vacuum and its application
Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO2 and the diffusion theory in porous media. I...
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Main Authors: | , , , |
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格式: | Article |
語言: | English |
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2009
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在線閱讀: | https://hdl.handle.net/10356/90757 http://hdl.handle.net/10220/5336 |
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機構: | Nanyang Technological University |
語言: | English |
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