Mathematical model of low-temperature wafer bonding under medium vacuum and its application
Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO2 and the diffusion theory in porous media. I...
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Main Authors: | Yu, Weibo, Wei, Jun, Tan, Cher Ming, Huang, Guang Yu |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Article |
Language: | English |
Published: |
2009
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/90757 http://hdl.handle.net/10220/5336 |
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Institution: | Nanyang Technological University |
Language: | English |
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