Mathematical model of low-temperature wafer bonding under medium vacuum and its application

• المؤلفون الرئيسيون: Yu, Weibo, Wei, Jun, Tan, Cher Ming, Huang, Guang Yu
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/90757; http://hdl.handle.net/10220/5336
• المؤسسة: Nanyang Technological University

Low-temperature direct wafer bonding was successfully performed under medium vacuum level. A mathematical model was developed based on the qualitative understanding of the bonding mechanisms. The model combined the diffusion-reaction model of water in SiO2 and the diffusion theory in porous media. I...