Integrated circuit ceramic ball grid array package antenna

The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit pack...

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Main Author: Zhang, Yue Ping
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2009
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Online Access:https://hdl.handle.net/10356/91243
http://hdl.handle.net/10220/5996
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-912432020-03-07T14:02:37Z Integrated circuit ceramic ball grid array package antenna Zhang, Yue Ping School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit package antenna (ICPA) for highly integrated RF transceivers. A compact ICPA of this type has, for the first time, been designed and fabricated in a ceramic ball grid array (CBGA) package format. The novel ICPA, except economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured antenna performance of the ICPA is presented. The effects of the different physical parts of the ICPA on the antenna performance are investigated. Results show that the ICPA achieved impedance bandwidth of 4.1% and radiation efficiency of 72%, and gain of 4.8 dBi at 5.715 GHz. Published version 2009-08-03T02:52:53Z 2019-12-06T18:02:13Z 2009-08-03T02:52:53Z 2019-12-06T18:02:13Z 2004 2004 Journal Article Zhang, Y. P. (2004). Integrated circuit ceramic ball grid array package antenna. IEEE Transactions On Antennas And Propagation. 52(10), 2538-2544. 0018-926X https://hdl.handle.net/10356/91243 http://hdl.handle.net/10220/5996 10.1109/TAP.2004.834427 en IEEE transactions on antennas and propagation IEEE Transactions On Antennas And Propagation © 2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site. 7 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Zhang, Yue Ping
Integrated circuit ceramic ball grid array package antenna
description The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit package antenna (ICPA) for highly integrated RF transceivers. A compact ICPA of this type has, for the first time, been designed and fabricated in a ceramic ball grid array (CBGA) package format. The novel ICPA, except economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured antenna performance of the ICPA is presented. The effects of the different physical parts of the ICPA on the antenna performance are investigated. Results show that the ICPA achieved impedance bandwidth of 4.1% and radiation efficiency of 72%, and gain of 4.8 dBi at 5.715 GHz.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Zhang, Yue Ping
format Article
author Zhang, Yue Ping
author_sort Zhang, Yue Ping
title Integrated circuit ceramic ball grid array package antenna
title_short Integrated circuit ceramic ball grid array package antenna
title_full Integrated circuit ceramic ball grid array package antenna
title_fullStr Integrated circuit ceramic ball grid array package antenna
title_full_unstemmed Integrated circuit ceramic ball grid array package antenna
title_sort integrated circuit ceramic ball grid array package antenna
publishDate 2009
url https://hdl.handle.net/10356/91243
http://hdl.handle.net/10220/5996
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