Integrated circuit ceramic ball grid array package antenna
The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit pack...
Saved in:
Main Author: | Zhang, Yue Ping |
---|---|
Other Authors: | School of Electrical and Electronic Engineering |
Format: | Article |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/91243 http://hdl.handle.net/10220/5996 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers
by: Zhang, Yue Ping
Published: (2009) -
Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
by: Wang, Jun Jun, et al.
Published: (2009) -
Integration of grid array antenna in chip package for highly integrated 60-GHz radios
by: Guo, Y. X., et al.
Published: (2010) -
Design and integration of 60-GHz grid array antenna in chip package
by: Sun, Mei, et al.
Published: (2010) -
Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
by: Joseph Erasmo A. Galang
Published: (2008)