Sensitivity analysis of coupled interconnects for RFIC applications

• Main Authors: Shi, Xiaomeng, Yeo, Kiat Seng, Ma, Jianguo, Do, Manh Anh, Li, Erping
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/91414; http://hdl.handle.net/10220/4665
• Institution: Nanyang Technological University

This paper investigates the sensitivity of on-wafer coupled interconnects to the Si CMOS process parameters. Experiments are conducted to emulate state-of-the-art and future technologies. Some important parameters characterizing the coupled interconnects have been examined. The influence of the proc...