Off-chip decoupling capacitor allocation for chip package co-design

• Main Authors: Yu, Hao, Chu, Chunta Lei He
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2012
• Online Access: https://hdl.handle.net/10356/94371; http://hdl.handle.net/10220/7904
• Institution: Nanyang Technological University

Off-chip decoupling capacitor (decap) allocation is a demanding task during package and chip codesign. Existing approaches can not handle large numbers of I/O counts and large numbers of legal decap positions. In this paper, we propose a fast decoupling capacitor allocation method. By applying a spe...