Off-chip decoupling capacitor allocation for chip package co-design

• المؤلفون الرئيسيون: Yu, Hao, Chu, Chunta Lei He
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2012
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94371; http://hdl.handle.net/10220/7904

Off-chip decoupling capacitor (decap) allocation is a demanding task during package and chip codesign. Existing approaches can not handle large numbers of I/O counts and large numbers of legal decap positions. In this paper, we propose a fast decoupling capacitor allocation method. By applying a spe...