Fracture toughness of Cu-Sn intermetallic thin films

• Main Authors: Li, M., Chen, Z., Balakrisnan, Bavani, Chum, Chan Choy, Cahyadi, Tommy
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: https://hdl.handle.net/10356/95014; http://hdl.handle.net/10220/8207
• Institution: Nanyang Technological University

Intermetallic compounds (IMCs) are formed as a result of interaction between solder and metallization to form joints in electronic packaging. These joints provide mechanical and electrical contacts between components. The knowledge of fracture strength of the IMCs will facilitate predicting the over...