Fracture toughness of Cu-Sn intermetallic thin films

• المؤلفون الرئيسيون: Li, M., Chen, Z., Balakrisnan, Bavani, Chum, Chan Choy, Cahyadi, Tommy
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/95014; http://hdl.handle.net/10220/8207
• المؤسسة: Nanyang Technological University

Intermetallic compounds (IMCs) are formed as a result of interaction between solder and metallization to form joints in electronic packaging. These joints provide mechanical and electrical contacts between components. The knowledge of fracture strength of the IMCs will facilitate predicting the over...