Buckling and cracking of thin films on compliant substrates under compression

It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (P...

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Main Authors: Cotterell, Brian, Chen, Zhong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/95456
http://hdl.handle.net/10220/8214
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-954562023-07-14T15:53:20Z Buckling and cracking of thin films on compliant substrates under compression Cotterell, Brian Chen, Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (PET) with a indium tin oxide (ITO) film, the energy release rate allowing for the deformation of the substrate can be more than an order of magnitude greater than the value obtained neglecting the substrate's deformation. The argument that buckling delaminations tunnel at the tip rather than spread sideways because of increase in mode-mixity may need modification; it is still true for stiff substrates, but for compliant substrates the average energy release rate decreases with delamination width and the limitation in buckled width may be due to this stability as much as the increase in mode-mixity. Accepted version 2012-06-20T03:51:06Z 2019-12-06T19:15:16Z 2012-06-20T03:51:06Z 2019-12-06T19:15:16Z 2000 2000 Journal Article Cotterell, B., & Chen, Z. (2000). Buckling and Cracking of Thin Films on Compliant Substrate under Compression. International Journal of Fracture, 104(2), 169-179. https://hdl.handle.net/10356/95456 http://hdl.handle.net/10220/8214 10.1023/A:1007628800620 en International journal of fracture © 2000 Kluwer Academic Publishers. This is the author created version of a work that has been peer reviewed and accepted for publication by International Journal of Fracture, Kluwer Academic Publishers. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1023/A:1007628800620]. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Cotterell, Brian
Chen, Zhong
Buckling and cracking of thin films on compliant substrates under compression
description It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (PET) with a indium tin oxide (ITO) film, the energy release rate allowing for the deformation of the substrate can be more than an order of magnitude greater than the value obtained neglecting the substrate's deformation. The argument that buckling delaminations tunnel at the tip rather than spread sideways because of increase in mode-mixity may need modification; it is still true for stiff substrates, but for compliant substrates the average energy release rate decreases with delamination width and the limitation in buckled width may be due to this stability as much as the increase in mode-mixity.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Cotterell, Brian
Chen, Zhong
format Article
author Cotterell, Brian
Chen, Zhong
author_sort Cotterell, Brian
title Buckling and cracking of thin films on compliant substrates under compression
title_short Buckling and cracking of thin films on compliant substrates under compression
title_full Buckling and cracking of thin films on compliant substrates under compression
title_fullStr Buckling and cracking of thin films on compliant substrates under compression
title_full_unstemmed Buckling and cracking of thin films on compliant substrates under compression
title_sort buckling and cracking of thin films on compliant substrates under compression
publishDate 2012
url https://hdl.handle.net/10356/95456
http://hdl.handle.net/10220/8214
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