Buckling and cracking of thin films on compliant substrates under compression
It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (P...
Saved in:
Main Authors: | Cotterell, Brian, Chen, Zhong |
---|---|
Other Authors: | School of Materials Science & Engineering |
Format: | Article |
Language: | English |
Published: |
2012
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/95456 http://hdl.handle.net/10220/8214 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
The fracture of brittle thin films on compliant substrates in flexible displays
by: Chen, Zhong, et al.
Published: (2012) -
Fracture toughness measurement of thin films on compliant substrate using controlled buckling test
by: Chen, Zhong, et al.
Published: (2012) -
Scratch resistance of brittle thin films on compliant substrates
by: Wu, Linda Y. L., et al.
Published: (2012) -
Buckling of a stiff thin film on a compliant substrate in large deformation
by: Song, J., et al.
Published: (2014) -
Prediction of the energy dissipation rate in ductile crack propagation
by: Atkins, A. G., et al.
Published: (2012)