Buckling and cracking of thin films on compliant substrates under compression

• Main Authors: Cotterell, Brian, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/95456; http://hdl.handle.net/10220/8214
• Institution: Nanyang Technological University

It is shown that unless the substrate is at least as stiff as the film, the energy stored in the substrate contributes significantly to the energy release rate of film delamination under compression either with or without cracking. For very compliant substrates, such as polyethylene terephthalate (P...