Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling

Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel...

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Main Authors: Qian, Hanhua, Huang, Xiwei, Yu, Hao, Chang, Chip Hong
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/95596
http://hdl.handle.net/10220/8744
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-955962020-03-07T14:02:44Z Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling Qian, Hanhua Huang, Xiwei Yu, Hao Chang, Chip Hong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel runtime temperature management is implemented to predict the real-time temperature demand based on software-sensing with prediction-and-correction. A 3D thermal model is developed to cater the real-time microfluidic thermal dynamics. An autoregressive (AR) prediction with correction is implemented by Kalman filtering to predict and correct the runtime power, which is further used to calculate the future temperature demand. With this software-sensing approach, thermal management can be performed in a cyber-physical fashion with real-time sensing, prediction-and-correction and fine-grained control. Compared to the existing works using on-chip temperature sensors, our closed-loop controller with software-sensing avoids the cost of sensor implementation and deployment. Our work analyzes and predicts the fine-grained temperature profile of multi-core processorcache system. It enables a number of microfluidic channels to be adjusted adaptively with different flow-rates to control the system temperature proactively as opposed to the static control with a uniform flow-rate for microfluidic channels. With the proposed cyber-physical temperature management scheme, it is shown that the temperature of multi-core system is suppressed below an acceptable thermal threshold. In fact, the fine-grained flow-rate control also achieves a more even temperature distribution and saves up to 72.1% of total flow-rate compared with uniform flow-rate controls. 2012-10-10T07:44:00Z 2019-12-06T19:17:59Z 2012-10-10T07:44:00Z 2019-12-06T19:17:59Z 2011 2011 Journal Article Qian, H., Huang, X., Yu, H., & Chang, C. H. (2011). Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling. Journal of Low Power Electronics, 7(1), 110-121. 1546-1998 https://hdl.handle.net/10356/95596 http://hdl.handle.net/10220/8744 10.1166/jolpe.2011.1121 156527 en Journal of low power electronics © 2011 American Scientific Publishers.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Qian, Hanhua
Huang, Xiwei
Yu, Hao
Chang, Chip Hong
Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
description Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel runtime temperature management is implemented to predict the real-time temperature demand based on software-sensing with prediction-and-correction. A 3D thermal model is developed to cater the real-time microfluidic thermal dynamics. An autoregressive (AR) prediction with correction is implemented by Kalman filtering to predict and correct the runtime power, which is further used to calculate the future temperature demand. With this software-sensing approach, thermal management can be performed in a cyber-physical fashion with real-time sensing, prediction-and-correction and fine-grained control. Compared to the existing works using on-chip temperature sensors, our closed-loop controller with software-sensing avoids the cost of sensor implementation and deployment. Our work analyzes and predicts the fine-grained temperature profile of multi-core processorcache system. It enables a number of microfluidic channels to be adjusted adaptively with different flow-rates to control the system temperature proactively as opposed to the static control with a uniform flow-rate for microfluidic channels. With the proposed cyber-physical temperature management scheme, it is shown that the temperature of multi-core system is suppressed below an acceptable thermal threshold. In fact, the fine-grained flow-rate control also achieves a more even temperature distribution and saves up to 72.1% of total flow-rate compared with uniform flow-rate controls.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Qian, Hanhua
Huang, Xiwei
Yu, Hao
Chang, Chip Hong
format Article
author Qian, Hanhua
Huang, Xiwei
Yu, Hao
Chang, Chip Hong
author_sort Qian, Hanhua
title Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
title_short Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
title_full Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
title_fullStr Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
title_full_unstemmed Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
title_sort cyber-physical thermal management of 3d multi-core cache-processor system with microfluidic cooling
publishDate 2012
url https://hdl.handle.net/10356/95596
http://hdl.handle.net/10220/8744
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