Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel...
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sg-ntu-dr.10356-955962020-03-07T14:02:44Z Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling Qian, Hanhua Huang, Xiwei Yu, Hao Chang, Chip Hong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel runtime temperature management is implemented to predict the real-time temperature demand based on software-sensing with prediction-and-correction. A 3D thermal model is developed to cater the real-time microfluidic thermal dynamics. An autoregressive (AR) prediction with correction is implemented by Kalman filtering to predict and correct the runtime power, which is further used to calculate the future temperature demand. With this software-sensing approach, thermal management can be performed in a cyber-physical fashion with real-time sensing, prediction-and-correction and fine-grained control. Compared to the existing works using on-chip temperature sensors, our closed-loop controller with software-sensing avoids the cost of sensor implementation and deployment. Our work analyzes and predicts the fine-grained temperature profile of multi-core processorcache system. It enables a number of microfluidic channels to be adjusted adaptively with different flow-rates to control the system temperature proactively as opposed to the static control with a uniform flow-rate for microfluidic channels. With the proposed cyber-physical temperature management scheme, it is shown that the temperature of multi-core system is suppressed below an acceptable thermal threshold. In fact, the fine-grained flow-rate control also achieves a more even temperature distribution and saves up to 72.1% of total flow-rate compared with uniform flow-rate controls. 2012-10-10T07:44:00Z 2019-12-06T19:17:59Z 2012-10-10T07:44:00Z 2019-12-06T19:17:59Z 2011 2011 Journal Article Qian, H., Huang, X., Yu, H., & Chang, C. H. (2011). Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling. Journal of Low Power Electronics, 7(1), 110-121. 1546-1998 https://hdl.handle.net/10356/95596 http://hdl.handle.net/10220/8744 10.1166/jolpe.2011.1121 156527 en Journal of low power electronics © 2011 American Scientific Publishers. |
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DRNTU::Engineering::Electrical and electronic engineering Qian, Hanhua Huang, Xiwei Yu, Hao Chang, Chip Hong Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling |
description |
Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with
the problem of die thermal run-away hazard. This teething problem is addressed by a real-time
demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel
runtime temperature management is implemented to predict the real-time temperature demand
based on software-sensing with prediction-and-correction. A 3D thermal model is developed to cater
the real-time microfluidic thermal dynamics. An autoregressive (AR) prediction with correction is
implemented by Kalman filtering to predict and correct the runtime power, which is further used to
calculate the future temperature demand. With this software-sensing approach, thermal management
can be performed in a cyber-physical fashion with real-time sensing, prediction-and-correction
and fine-grained control. Compared to the existing works using on-chip temperature sensors, our
closed-loop controller with software-sensing avoids the cost of sensor implementation and deployment.
Our work analyzes and predicts the fine-grained temperature profile of multi-core processorcache
system. It enables a number of microfluidic channels to be adjusted adaptively with different
flow-rates to control the system temperature proactively as opposed to the static control with a uniform
flow-rate for microfluidic channels. With the proposed cyber-physical temperature management
scheme, it is shown that the temperature of multi-core system is suppressed below an acceptable
thermal threshold. In fact, the fine-grained flow-rate control also achieves a more even temperature
distribution and saves up to 72.1% of total flow-rate compared with uniform flow-rate controls. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Qian, Hanhua Huang, Xiwei Yu, Hao Chang, Chip Hong |
format |
Article |
author |
Qian, Hanhua Huang, Xiwei Yu, Hao Chang, Chip Hong |
author_sort |
Qian, Hanhua |
title |
Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling |
title_short |
Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling |
title_full |
Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling |
title_fullStr |
Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling |
title_full_unstemmed |
Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling |
title_sort |
cyber-physical thermal management of 3d multi-core cache-processor system with microfluidic cooling |
publishDate |
2012 |
url |
https://hdl.handle.net/10356/95596 http://hdl.handle.net/10220/8744 |
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1681049555287670784 |