Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling

• Main Authors: Qian, Hanhua, Huang, Xiwei, Yu, Hao, Chang, Chip Hong
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/95596; http://hdl.handle.net/10220/8744
• Institution: Nanyang Technological University

Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel...