Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling
Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel...
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/95596 http://hdl.handle.net/10220/8744 |
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| Institution: | Nanyang Technological University |
| Language: | English |