Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling

• المؤلفون الرئيسيون: Qian, Hanhua, Huang, Xiwei, Yu, Hao, Chang, Chip Hong
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/95596; http://hdl.handle.net/10220/8744
• المؤسسة: Nanyang Technological University

Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel...