Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) fl...
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| Main Authors: | , , |
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| 格式: | Conference or Workshop Item |
| 語言: | English |
| 出版: |
2013
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/96479 http://hdl.handle.net/10220/17272 |
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| 總結: | A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized. |
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