Thermal-mechanical design of sandwich SiC power module with micro-channel cooling

A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) fl...

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Main Authors: Yin, Shan, Tseng, King Jet, Zhao, Jiyun
Other Authors: School of Electrical and Electronic Engineering
Format: Conference or Workshop Item
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/96479
http://hdl.handle.net/10220/17272
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-964792020-03-07T13:24:47Z Thermal-mechanical design of sandwich SiC power module with micro-channel cooling Yin, Shan Tseng, King Jet Zhao, Jiyun School of Electrical and Electronic Engineering IEEE International Conference on Power Electronics and Drive Systems (10th : 2013 : Kitakyushu, Japan) DRNTU::Engineering::Electrical and electronic engineering A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized. 2013-11-05T05:49:45Z 2019-12-06T19:31:17Z 2013-11-05T05:49:45Z 2019-12-06T19:31:17Z 2013 2013 Conference Paper Yin, S., Tseng, K. J., & Zhao, J. (2013). Thermal-mechanical design of sandwich SiC power module with micro-channel cooling. 2013 IEEE 10th International Conference on Power Electronics and Drive Systems (PEDS), 535-540. https://hdl.handle.net/10356/96479 http://hdl.handle.net/10220/17272 10.1109/PEDS.2013.6527077 en
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Yin, Shan
Tseng, King Jet
Zhao, Jiyun
Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
description A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Yin, Shan
Tseng, King Jet
Zhao, Jiyun
format Conference or Workshop Item
author Yin, Shan
Tseng, King Jet
Zhao, Jiyun
author_sort Yin, Shan
title Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
title_short Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
title_full Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
title_fullStr Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
title_full_unstemmed Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
title_sort thermal-mechanical design of sandwich sic power module with micro-channel cooling
publishDate 2013
url https://hdl.handle.net/10356/96479
http://hdl.handle.net/10220/17272
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