Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) fl...
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Main Authors: | Yin, Shan, Tseng, King Jet, Zhao, Jiyun |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Conference or Workshop Item |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/96479 http://hdl.handle.net/10220/17272 |
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Institution: | Nanyang Technological University |
Language: | English |
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