Improved mechanical and thermomechanical properties of alumina substrate via iron doping

We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant to pure alumina. Such properties are beneficial for harsh envir...

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Bibliographic Details
Main Authors: Made, Riko I., Phua, Eric Jian Rong, Pramana, Stevin Snellius, Wong, Chee Cheong, Chen, Zhong, Gan, Chee Lip, Tok, Alfred Iing Yoong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/97055
http://hdl.handle.net/10220/9984
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Institution: Nanyang Technological University
Language: English
Description
Summary:We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant to pure alumina. Such properties are beneficial for harsh environment electronic packages. X-Ray and electron probe micros analysis concluded that toughening are likely contributed by multiple phases strengthening and ruled out crack bridging or grain boundary strengthening.