Improved mechanical and thermomechanical properties of alumina substrate via iron doping
We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant to pure alumina. Such properties are beneficial for harsh envir...
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Main Authors: | , , , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/97055 http://hdl.handle.net/10220/9984 |
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Institution: | Nanyang Technological University |
Language: | English |
Summary: | We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant to pure alumina. Such properties are beneficial for harsh environment electronic packages. X-Ray and electron probe micros analysis concluded that toughening are likely contributed by multiple phases strengthening and ruled out crack bridging or grain boundary strengthening. |
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