Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding

Microfabrication using replication techniques such as hot embossing and injection molding followed by thermal sealing with a cover plate have been widely used in the large scale manufacturing of polymer based micro-devices for bio and chemical-MEMS (Micro Electro Mechanical Systems) applications. Wh...

Full description

Saved in:
Bibliographic Details
Main Authors: Jena, Rajeeb Kumar, Dev, Kapil, Yue, Chee Yoon, Asundi, Anand Krishna
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/97196
http://hdl.handle.net/10220/10594
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-97196
record_format dspace
spelling sg-ntu-dr.10356-971962020-03-07T13:22:17Z Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding Jena, Rajeeb Kumar Dev, Kapil Yue, Chee Yoon Asundi, Anand Krishna School of Mechanical and Aerospace Engineering Singapore-MIT Alliance, Manufacturing Systems and Technology Programme Microfabrication using replication techniques such as hot embossing and injection molding followed by thermal sealing with a cover plate have been widely used in the large scale manufacturing of polymer based micro-devices for bio and chemical-MEMS (Micro Electro Mechanical Systems) applications. While several parameters are known to affect the integrity of microchannel replication, they have not been characterized and studied. These parameters include the influence of (i) in built residual stresses in substrate materials, made by injection molding, on replication fidelity during microfabrication using the hot embossing technique, (ii) sealing of injection molded microchips during thermal bonding and (iii) replication fidelity of annealed and unannealed substrates during hot embossing. This is the focus of the current work. Residual stresses were analysed using a grey-field polariscope and the fidelity of microreplication was characterized using a PLμ confocal microscope and a scanning electron microscope. It was found that the significant variation in replication fidelity of the injection molded substrate correlated well with the observed differences in the distribution of residual stresses. Good replication was obtained in regions with low residual stresses. The annealed substrate which had a low residual stress state with little chain orientation exhibited no variation in replication fidelity both along and across the flow direction of the injection molded substrate. Furthermore, the microchannels in the unannealed injection molding substrate exhibited significant distortion and deformation during subsequent thermal bonding. 2013-06-25T03:17:44Z 2019-12-06T19:40:06Z 2013-06-25T03:17:44Z 2019-12-06T19:40:06Z 2012 2012 Journal Article Jena, R. K., Dev, K., Yue, C. Y., & Asundi, A. K. (2012). Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding. RSC advances, 2(13), 5717-5728. 2046-2069 https://hdl.handle.net/10356/97196 http://hdl.handle.net/10220/10594 10.1039/c2ra20159c en RSC advances © 2012 The Royal Society of Chemistry.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
description Microfabrication using replication techniques such as hot embossing and injection molding followed by thermal sealing with a cover plate have been widely used in the large scale manufacturing of polymer based micro-devices for bio and chemical-MEMS (Micro Electro Mechanical Systems) applications. While several parameters are known to affect the integrity of microchannel replication, they have not been characterized and studied. These parameters include the influence of (i) in built residual stresses in substrate materials, made by injection molding, on replication fidelity during microfabrication using the hot embossing technique, (ii) sealing of injection molded microchips during thermal bonding and (iii) replication fidelity of annealed and unannealed substrates during hot embossing. This is the focus of the current work. Residual stresses were analysed using a grey-field polariscope and the fidelity of microreplication was characterized using a PLμ confocal microscope and a scanning electron microscope. It was found that the significant variation in replication fidelity of the injection molded substrate correlated well with the observed differences in the distribution of residual stresses. Good replication was obtained in regions with low residual stresses. The annealed substrate which had a low residual stress state with little chain orientation exhibited no variation in replication fidelity both along and across the flow direction of the injection molded substrate. Furthermore, the microchannels in the unannealed injection molding substrate exhibited significant distortion and deformation during subsequent thermal bonding.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Jena, Rajeeb Kumar
Dev, Kapil
Yue, Chee Yoon
Asundi, Anand Krishna
format Article
author Jena, Rajeeb Kumar
Dev, Kapil
Yue, Chee Yoon
Asundi, Anand Krishna
spellingShingle Jena, Rajeeb Kumar
Dev, Kapil
Yue, Chee Yoon
Asundi, Anand Krishna
Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
author_sort Jena, Rajeeb Kumar
title Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
title_short Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
title_full Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
title_fullStr Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
title_full_unstemmed Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
title_sort effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding
publishDate 2013
url https://hdl.handle.net/10356/97196
http://hdl.handle.net/10220/10594
_version_ 1681035821140934656