Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding

Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding

Microfabrication using replication techniques such as hot embossing and injection molding followed by thermal sealing with a cover plate have been widely used in the large scale manufacturing of polymer based micro-devices for bio and chemical-MEMS (Micro Electro Mechanical Systems) applications. Wh...

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Bibliographic Details
Main Authors: Jena, Rajeeb Kumar, Dev, Kapil, Yue, Chee Yoon, Asundi, Anand Krishna
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/97196
http://hdl.handle.net/10220/10594
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Institution: Nanyang Technological University
Language: English

Internet

https://hdl.handle.net/10356/97196
http://hdl.handle.net/10220/10594

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