Effect of residual stresses in injection molded cyclic olefin copolymer during microfabrication : hot embossing as well as thermal bonding

• المؤلفون الرئيسيون: Jena, Rajeeb Kumar, Dev, Kapil, Yue, Chee Yoon, Asundi, Anand Krishna
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/97196; http://hdl.handle.net/10220/10594

Microfabrication using replication techniques such as hot embossing and injection molding followed by thermal sealing with a cover plate have been widely used in the large scale manufacturing of polymer based micro-devices for bio and chemical-MEMS (Micro Electro Mechanical Systems) applications. Wh...