A self-rectifying unipolar HfOx based RRAM using doped germanium bottom electrode

A self-rectifying unipolar RRAM based on HfOx dielectrics using highly doped n-type germanium substrate as the bottom electrode is proposed for the first time. The RRAM cells exhibit a stable unipolar resistive switching behavior. Owning to Schottky barrier between defect states in HfOx layer and n-...

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Main Authors: Liu, W. J., Tran, Xuan Anh, Sun, Xiaowei, Yu, Hongyu
其他作者: School of Electrical and Electronic Engineering
格式: Article
語言:English
出版: 2013
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在線閱讀:https://hdl.handle.net/10356/97684
http://hdl.handle.net/10220/13176
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機構: Nanyang Technological University
語言: English
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總結:A self-rectifying unipolar RRAM based on HfOx dielectrics using highly doped n-type germanium substrate as the bottom electrode is proposed for the first time. The RRAM cells exhibit a stable unipolar resistive switching behavior. Owning to Schottky barrier between defect states in HfOx layer and n-Ge substrate, RRAM cells possess a self-rectifying behavior in LRS which eliminates the read-out errors induced by leakage current paths in cross-bar array structure. The demonstrated RRAM device shows high ON/OFF ratio (>5 × 102 @ 0.5 V), and its effective Schottky barrier height is also addressed. The demonstrated HfOx-based RRAM devices provide a promising candidate as non-volatile memory devices using Ge-based technology.