Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects

• Main Authors: Chip-Hong Chang, Wei Zhang, Hao Yu, Qian, Hanhua, Liang, Hao
• Other Authors: School of Computer Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/98133; http://hdl.handle.net/10220/17974
• Institution: Nanyang Technological University

This paper presents a fast and accurate steady state thermal simulator for heatsink and microfluid-cooled 3D-ICs. This model considers the thermal effect of TSVs at fine-granularity by calculating the anisotropic equivalent thermal conductances of a solid grid cell if TSVs are inserted. Entrance eff...