Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects

This paper presents a fast and accurate steady state thermal simulator for heatsink and microfluid-cooled 3D-ICs. This model considers the thermal effect of TSVs at fine-granularity by calculating the anisotropic equivalent thermal conductances of a solid grid cell if TSVs are inserted. Entrance eff...

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Bibliographic Details
Main Authors: Chip-Hong Chang, Wei Zhang, Hao Yu, Qian, Hanhua, Liang, Hao
Other Authors: School of Computer Engineering
Format: Conference or Workshop Item
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/98133
http://hdl.handle.net/10220/17974
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Institution: Nanyang Technological University
Language: English

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